PCB Laser Cutting/Depaneling.
PCB Laser Cutting/Depaneling.
Separation of PCB.
The Neo platform offers a wide range of highly competitive products to meet the market’s multifaceted demands: focus on accuracy, speed, affordability and flexibility. Our PCB Laser Cutting/Depaneling systems can offer quality processes for the separation of printed circuit boards, either Mechanical or Laser.
OSAI’s solutions are compatible with different sources Laser: CO2, Fiber, UV or Green and IR Ultrafast Pico. Depending on the parameters, i.e. the processing material, the carbonization effect – cut wall, the cycle time and the investment value, we can identify the most suitable source to optimize the production processes.
